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ADE7816
ABSOLUTE MAXIMUM RATINGS
T A = 25°C, unless otherwise noted.
Data Sheet
Table 5.
Parameter
VDD to AGND
VDD to DGND
Analog Input Voltage to AGND, IAP, IAN,
IBP, IBN, ICP, ICN, IDP, IEP, IFP, IN
Analog Input Voltage to VP and VN
Reference Input Voltage to AGND
Digital Input Voltage to DGND
Rating
?0.3 V to +3.7 V
?0.3 V to +3.7 V
?2 V to +2 V
?2 V to +2 V
?0.3 V to VDD + 0.3 V
?0.3 V to VDD + 0.3 V
Regarding the temperature profile used in soldering RoHS-
compliant parts, Analog Devices, Inc., advises that reflow profiles
should conform to J-STD-20 from JEDEC. Refer to the JEDEC
website for the latest revision.
THERMAL RESISTANCE
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Digital Output Voltage to DGND
Operating Temperature
?0.3 V to VDD + 0.3 V
Package Type
40-Lead LFCSP
θ JA
29.3
θ JC
1.8
Unit
°C/W
Industrial Range
?40°C to +85°C
Storage Temperature Range
Junction Temperature
?65°C to +150°C
150°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. A | Page 8 of 48
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